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• Applications
• Quality
• Product offering

IPS optimized industrial technology is specifically designed to address the needs of high quality Solder Spheres for BGA & CSP packages.
IPS product features include :

• - Economical competitiveness
• - Remarkable lot-to-lot consistency
• - Perfect size distribution and roundness
• - Preserved bright surface with controlled oxidation level
• - Uniform alloy composition

Additional Benefits

IPS standard packaging comes with sealed antistatic plastic jars filled with inert gas. Custom services are also available :

• - Special colour labels for size differentiation
• - Custom labellings
• - Bar codes for stock and JIT management
• - Desiccant and / or vacuum sealing