IPS optimized industrial technology is specifically designed to address the needs of high quality Solder Spheres for BGA & CSP packages.
IPS product features include :
- - Economical competitiveness
- - Remarkable lot-to-lot consistency
- - Perfect size distribution and roundness
- - Preserved bright surface with controlled oxidation level
- - Uniform alloy composition
Additional Benefits
IPS standard packaging comes with sealed antistatic plastic jars filled with inert gas. Custom services are also available :
- - Special colour labels for size differentiation
- - Custom labellings
- - Bar codes for stock and JIT management
- - Desiccant and / or vacuum sealing