IPS Solder Spheres – Micro spheres

IPS Solder Spheres – Micro spheres

Product offering

Micro-Spheres

Like most of the package types, array packages are driven by a constant miniaturization. BGA migration to Fine pitch BGA (FBGA), Chip Scale Packages (CSP) or wafer bumping application implies smaller Solder Spheres. Again, IPS Solder Sphere manufacturing process has proven to be the most adapted process to Micro-Spheres (Micro-Spheres diameters are understood below 20 mil or 508µm) enabling the Company to produce Spheres with very tight size distribution and irreproachable surface condition.

Lead - Free Spheres

The whole semiconductor industry is today driven by ecological consideration and safe handling products. IPS is today ready to supply its customers with any kind of alloy requested by the market. The Company having its own foundry in addition to its metallurgical expertise, IPS is able to respond fast to any lead-free alloy inquiry guaranteeing fine product and JIT delivery.

IPS Solder Spheres – Micro spheres