IPS – R & D – solder pastes – solder creams – solder balls bga

IPS – R & D – solder pastes – solder creams – solder balls bga

R&D and innovation

In-house metallurgical expertise

IPS has a long-time metallurgical experience of electronic grade solder alloys ( classical SnPb, SnPbAg or SAC ) as well as higher melting point alloys like Pb-rich, SnBi, SnAgBi, SnZn or SnZnBi for example and each different request has potential enhancement doping solution.

IPS – R & D – solder pastes – solder creams – solder balls bga

Doping optimization lead solder joint to enhanced results in various metallurgical characteristics like ductility, shear or pull strength, resistance to mechanical or thermal shocks that are key assets for certain applications.

IPS – R & D – solder pastes – solder creams – solder balls bga

Intermetallic growth condition depends on dopant selection
(with the courtesy of Qimonda).