IPS Solder Powders Particle Size Distribution

IPS Solder Powders Particle Size Distribution

Product Offering

Sizes

The IPS manufacturing process leads the Company's Solder Powders to rate among the best in the market. Their superior characteristics enable our customers to successfully develop new generations of products for the SMT (Surface Mount Technology). Indeed, alloy purity, oxide level, particle shape and distribution, lot-to-lot consistency make IPS Solder Powders fully compatible with No-Clean and Water-Soluble flux binder chemistries used for the formulation of new generations of Solder Pastes.

Type 2 >80µm >75µm 45µm<R<75µm <20µm Distribution Histogram
JS TD-006 0% 1% max 80% min 10% max Distribution histogram - Type2
JS TD-006B N / A N / A 80% min N / A N / A
Type 3 >50µm >45µm 25µm<R<45µm <20µm  
JS TD-006 0% 1% max 80% min 10% max Distribution histogram - Type3P
JS TD-006B N / A N / A 80% min N / A Distribution histogram - Type3MU
Type 4 >40µm >38µm 20µm<R<38µm <20µm  
JS TD-006 0% 1% max 90% min 10% max Distribution histogram - Type4A
JS TD-006B N / A N / A 85% min N / A Distribution histogram - Type4D
Type 5 >28µm >25µm 15µm<R<25µm <15µm  
JS TD-006 0% 1% max 90% min 10% max Distribution histogram - Type5A
Type 6 >18µm >15µm 5µm<R<15µm <5µm  
JS TD-006 0% 1% max 90% min 10% max Distribution histogram - Type6A
JS TD-006B N / A N / A 85% min N / A N / A

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