IPS Solder powders for electronic assembly Solder spheres for semiconductor packaging industry

IPS Solder powders for electronic assembly Solder spheres for semiconductor packaging industry

IPS

IPS experience leads to expertise and recognition among the world leaders

IPS is a 25 year old company with genuine expertise on brazing alloys production for the electronic and semiconductor industries. Thanks to strong relationship with world-class actors, IPS maintains its high position in the field of Solder Powders for Solder Paste and thus PWB assembly, as well as Solder Spheres for BGA, CSP, modules, Flip-Chip or wafer bumping manufacturing.

IPS is a member of joint projects within R&D development consortia and maintains permanent contacts with several universities.

IPS is a fully independent company continuously developing its own production processes. In this field, IPS has constantly improved its technology, mastering alloy manufacturing, metal granulation and sorting techniques.

Headquartered in Annemasse, France, across the border from Geneva, the industrial complex includes several buildings accommodating the various production units, warehouses, R&D and administration.

Furthermore, IPS has increased its presence in Asia by establishing a second production site in Suzhou, China, to accompany the growing local demand. This state-of-the-art factory is aimed to serve the Chinese market as well as to enhance company competitiveness. Coverage of the Asian region is provided through IPS proprietary sales office based in Singapore.

IPS is an ISO 9001 : 2008 certified company and employs today around 110 people worldwide.

Company profile IPS Solder powders for electronic assembly Solder spheres for semiconductor packaging industry